Except the granularity of tungsten powder, copper (Cu) content also has an influence on the comprehensive properties of tungsten copper electrode. There is product with different copper content by two kinds of infiltration process (Conventional infiltration CV, Microwave infiltration MW) comparison:
tungsten copper property picture
The table to compare the performance of tungsten copper alloy electrodes by different proportions of the product relative density, electrical conductivity and Brinell hardness (HB) and several parameters under different infiltration process. View from the sheet, we can easily see that the tungsten-copper alloy melting exudation W-Cu electrode relative density can reach more than 98%, almost densified; The content of Cu sample density had a significant impact, the higher the content, at the same sintering conditions caused by the resulting higher density of the sample, but it is not related with the way of sintering.
Tungsten particles contact with each other at high temperatures more prone to diffusion of tungsten atoms, which produce a solid phase sintering, the result is a bond between the touching particles, resulting in tungsten grains or particles bonded network state consolidation and grow up. From the whole process, we can see the evolution of rearrangement tungsten particles by means of copper liquid flow and wetting carried out, and therefore how much liquid volume determines the rearrangement of the tungsten particles can be fully unfolded, apparently improving the copper content in favor of tungsten-copper material particle rearrangements were more conducive to densification.
