Tungsten alloy ultra thin sheet has high density, high modulus of elasticity, high hardness, low coefficient of expansion, excellent electrical conductivity, thermal conductivity, mechanical properties, absorption of X-rays and gamma rays, etc. It is widely used in electronics.
Preparation
First, tungsten alloy foil substrate is used as a raw material, and the tungsten powder and the specified metal powder are mixed and adhered on a raw material board, and then they are respectively fused in a furnace filled with protective gas to form a transparent tungsten alloy thin plate.
Tungsten alloy ultra thin sheet is slowly heated in the shielding gas to a temperature higher than the melting point of the raw material plate so that the raw material plate completely infiltrates the permeated tungsten alloy structure to obtain the desired size.
Applications
The main board is used for LED lamps, televisions, circuit boards, and also for other electronic fields, including EDM motors, welding motors, electrolysis points, and air switches.It can be used for IPAD, IPHONE and CPU electronic packaging.
More details, please visit:
http://www.tungsten-alloy.com/tungsten-alloy-ultra-thin-sheet.html
