Tungsten copper slab with the properties of tungsten’s high strength, high stiffness, low thermal expansion coefficient and copper’s high plasticity, good electrical and thermal conductivity and other properties. In large scale integrated circuits and high-power microwave devices, tungsten copper alloy material as the substrate, the slug, connectors and cooling components have developed rapidly.
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Tungsten Copper Slab Picture
However, tungsten copper slab when used as electronic packaging materials, the density must be greater than 98% theoretical density, in order to ensure a high thermal conductivity, thus increasing the density of tungsten copper alloy tungsten copper alloy sheet is the key to performance guarantees.
